INTERNATIONAL_ The most advanced chips today, which are suitable for gaming, but the current problem is that it causes the device to heat up too quickly.
Chip overheating is an important part of the manufacturing process and a concern of the gaming community. Chipmakers continue to find ways to make chips cooler, without affecting overall performance.
There are reports that the top three chips that will debut in some of this year’s flagship smartphones may experience overheating problems.
These chips are: Qualcomm Snapdragon 8 Gen 1, Samsung Exynos 2200 and MediaTek Dimensity 9000. All are high-end functional chips from different manufacturers.
Taiwanese company TSMC is the manufacturer of the Dimensity 9000 while Samsung Foundry assembles both the Exynos 2200 and the Snapdragon 8 Gen 1. All three chips are manufactured using the 4nm node process.
Recently, the tester community has had a number of tweets pointing to overheating problems in these top-of-the-line chips. The Snapdragon 8 Gen 1 is said to overheat when playing games or using it on the Motorola Edge X30, one of the few models with a flagship chip.
TSMC has a superior 4nm process compared to Samsung Foundry, so the Dimensity 9000 can perform better and experience less overheating than the other two chips.
Playing games with hot machine has a big impact on the quality of players’ gaming. We will have an uncomfortable feeling in the handle when the heat generated is too hot. Not only that, it will partly affect the quality of operation of the internal parts of the machine.
It is now essential for developers to find a way to fix this problem, most importantly if it is aimed at gaming devices.
Although the opinions of the experiencers differ from each other, it remains to be seen how the specific needs of users with these high-end chips will be this year. The global chip shortage is expected to continue in the first half of 2022, significantly affecting user demand.